PQFN8*9 Description

Based on a high efficiency, ultra-compact and highly integrated PQFN package, the PQFN IPM uses PCB copper foil to dissipate heat and eliminates external heat sinks. It also provides a new benchmark that is comparable in size to any competing solution. It is mainly suitable for space-demanding applications such as hair dryers, with a power range of less than 100W.


PQFN8*9 IPM Features and Benefits:

  • Other packaged modules are poor in terms of heat dissipation from the PCB, and the only way to dissipate power is through an external heat sink, but this adds cost and creates oscillations and other physical stresses;
  • PQFN IPM current capability also depends on the PCB design, especially copper thickness, copper area and number of layers, and ultimately depends on the maximum allowable PCB temperature;
  • Especially suitable for applications with small space and small area, replacing traditional low-power solutions, no need for radiators;
  • Half bridge structure, more flexible application;
PQFN8*9
Parameters

Product

number

Voltage
(V)
Current
(A)

Insulation

withstand

voltage

(KV)

Optimization

Switch

(KHz)
Device

Recommend

power

(W)

Thermal

interface

Bootstrap

diode

Undervoltage

protection

Overcurrent

protection

Temperature

Output

Interlock VCE
VF
(Typ)
(V)
Rth
(j-c)(Max)
(℃/W)
(SAT)(Typ)
(V)
XNM03H54D5 500 3 1.5 20 MOSFET 50 PCB Yes Yes No No Yes 3 1.5 1.6
XNM05H54D5 500 5 1.5 20 MOSFET 120 PCB Yes Yes No No Yes 1.6 1.5 1.5
XNS04H54D6 600 4 1.5 20 IGBT 60 PCB Yes Yes No No Yes 2.1 1.5 1.3
XNS06H54D6 600 6 1.5 20 IGBT 150 PCB Yes Yes No No Yes 2.1 1.4 1.3
XNS04H54E6 600 4 1.5 20 IGBT 60 PCB Yes Yes No VOT Yes 2.1 1.5 1.3
XNS06H54E6 600 6 1.5 20 IGBT 150 PCB Yes Yes No VOT Yes 2.1 1.4 1.3