DIP24 Description

DIP24 IPM uses an insulated metal substrate (IMS) to achieve low thermal resistance and high power density, small package size, and a low-cost solution of more than 200W. The maximum current can be extended to 10A. At present, it has been widely used in applications such as range hood fans and washing machines.

DIP24 IPM Features and Benefits:

  • Low thermal resistance with aluminum substrate, even heat distribution, built-in heat sink copper block for low thermal resistance and high heat capacity. More suitable for pulse type load applications such as washing machines.
  • Low thermal resistance with aluminum substrate, even heat distribution, built-in heat sink copper block for low thermal resistance and high heat capacity. More suitable for pulse type load applications such as washing machines.
  • Small packages enable high power density for cost-effective solutions.

DIP24
Parameters

Product

number

Voltage
(V)
Current
(A)

Insulation

withstand

voltage

(KV)

Optimization

Switch

(KHz)
Device

Recommend

power

(W)

Thermal

interface

Bootstrap

diode

Undervoltage

protection

Overcurrent

protection

Temperature

Output

Interlock RDS(on)(Typ)
(Ω)
VF
(Typ)
(V)
Rth
(j-c)(Max)
(℃/W)
VCE
(SAT)(Typ)
(V)
XNS04S84F6 600 4 2 20 IGBT 250 DBC Yes Yes Yes NTC Yes 2 1.5 4.9
XNS06S84F6 600 6 2 20 IGBT 400 DBC Yes Yes Yes NTC Yes 2.1 1.7 4.1
XNS08S84F6 600 8 2 20 IGBT 600 DBC Yes Yes Yes NTC Yes 2.1 1.7 3.2
XNS10S84F6 600 10 2 20 IGBT 800 DBC Yes Yes Yes NTC Yes 1.8 1.5 2.8
XNS15S84F6 600 15 2 20 IGBT 1000 DBC Yes Yes Yes NTC Yes 1.9 1.9 2.5